| Preparation and adhesion of a dual-component self-assembled dual-layer film on silicon by a dip-coating nanoparticles method | |
| Department | 固体润滑国家重点实验室 |
| Mo YF(莫宇飞); Bai MW(白明武) | |
| 2008 | |
| Source Publication | Journal of Physical Chemistry C
 |
| ISSN | 1932-7447 |
| Volume | 112Pages:11257-11264 |
| Abstract | A novel microfabrication method is presented to fabricate with spatial control a dual-component self-assemble dual-layer film on silicon by dip-coating nanoparticles. In this research, the same chain length carboxyl acids with a fluorocarbon backbone chain and hydrocarbon backbone chain were composite-prepared on 3-aminopropyltriethoxysilane (APS) self-assembled monolayer (SAM). Film wettability was determined by measurement of contact angle, and thickness was determined with the ellipsometric method. Changes in adhesive properties of the film are determined by atomic force microscopy (AFM). |
| Subject Area | 材料科学与物理化学 |
| Funding Organization | the Innovative Group Foundation from the National Natural Science Foundation of China (NSFC) under Grant No. 20773148;NSFC 50675217;National 973 Program 2007CB607601 |
| Indexed By | SCI |
| Language | 英语 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/2648 |
| Collection | 固体润滑国家重点实验室（LSL） |
| Corresponding Author | Bai MW(白明武) |
| Recommended Citation GB/T 7714 | Mo YF,Bai MW. Preparation and adhesion of a dual-component self-assembled dual-layer film on silicon by a dip-coating nanoparticles method[J]. Journal of Physical Chemistry C,2008,112:11257-11264. |
| APA | 莫宇飞,&白明武.(2008).Preparation and adhesion of a dual-component self-assembled dual-layer film on silicon by a dip-coating nanoparticles method.Journal of Physical Chemistry C,112,11257-11264. |
| MLA | 莫宇飞,et al."Preparation and adhesion of a dual-component self-assembled dual-layer film on silicon by a dip-coating nanoparticles method".Journal of Physical Chemistry C 112(2008):11257-11264. |
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| 200811257-11264.PDF（3010KB） | 开放获取 | License | View Application Full Text | |||
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