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Direct-writing polyimide additive manufacturing material and preparation method thereof 专利
专利类型: 发明专利, 专利号: US 11020895 B2, 申请日期: 2021-06-01,
Inventors:  Wang XL(王晓龙);  Guo YX(郭玉雄);  Yan CY(闫昌友);  Liu ZL(刘志鲁);  Zhou F(周峰)
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Direct ink writing with high-strength and swelling-resistant biocompatible physically crosslinked hydrogels 期刊论文
Biomaterials Science, 2019, 期号: 7, 页码: 1805-1814
Authors:  Jiang P(蒋盼);  Yan CY(闫昌友);  Guo YX(郭玉雄);  Zhang XQ(张晓琴);  Cai MR(蔡美荣);  Jia X(贾鑫);  Wang XL(王晓龙);  Zhou F(周峰)
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Direct Ink Writing of High Performance Architectured Polyimides with Low Dimensional Shrinkage 期刊论文
Advanced Engineering Materials, 2019, 期号: 21, 页码: 1801314
Authors:  Guo YX(郭玉雄);  Xu JW(徐嘉文);  Yan CY(闫昌友);  Chen YQ(陈彦秋);  Zhang XQ(张晓琴);  Jia X(贾鑫);  Liu Y(刘禹);  Wang XL(王晓龙);  Zhou F(周峰)
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3D printing  low dimensional shrinkage  photocuring direct ink writing  polyimides  thermoset polymers  
无权访问的条目 项目
Leaders:  王晓龙;  吴杨;  麻拴红;  马正峰;  林鹏;  张冉;  姬忠莹;  闫昌友;  郭玉雄
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