| Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour | |
| Department | 固体润滑国家重点实验室 ; 先进润滑与防护材料研究发展中心 |
Gao XM(高晓明) ; Sun JY(孙嘉奕); Hu M(胡明); Weng LJ(翁立军); Zhou F(周峰); Liu WM(刘维民)
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| 2011 | |
| Source Publication | Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology
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| ISSN | 1350-6501 |
| Volume | 225Pages:1121-1129 |
| Abstract | Cu films were prepared by arc ion plating (AIP) at low temperature (Ts) and investigated by X-ray diffraction, field emission scanning electron microscope atomic force microscopy, transmission electron microscope, etc. It is found that low Ts ( 221 K) can refine the crystallite size of the Cu films and leads to compact and smooth surface structure. Further decreasing Ts to 135 K makes the inter-grain gaps turn bigger. The wear behaviours of the Cu films in vacuum were characterized using a ball-on-disk tribometer. The results show that the Cu films deposited at the Ts range of 135–221 K have better wear resistance, and the wear rates are two to three orders lower than that of the film deposited at room temperature. The compact and dense arrangement of nanoscale crystallites significantly contributes to the improved film–substrate adhesion and so the excellent antiwear behaviour. |
| Keyword | Low Temperature Structure Wear Behaviour Cu Films |
| Subject Area | 材料科学与物理化学 |
| Funding Organization | the National Natural Science Foundation of China [Grant no. 50301015];the 973 Project [no. 2007CB607601] of China |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | PVD润滑薄膜组 ; 材料表面与界面行为研究组 ; 空间润滑材料组 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/744 |
| Collection | 固体润滑国家重点实验室（LSL） 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
| Corresponding Author | Liu WM(刘维民) |
| Recommended Citation GB/T 7714 | Gao XM,Sun JY,Hu M,et al. Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour[J]. Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology,2011,225:1121-1129. |
| APA | 高晓明,孙嘉奕,胡明,翁立军,周峰,&刘维民.(2011).Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour.Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology,225,1121-1129. |
| MLA | 高晓明,et al."Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour".Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology 225(2011):1121-1129. |
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| 20111121-1129.PDF（447KB） | 开放获取 | License | View Application Full Text | |||
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