Microstructure Evolution and Enhanced Tribological Properties of Cu-Doped WS2 Films | |
Department | 固体润滑国家重点实验室 |
Xu SS(徐书生)1,2; Gao XM(高晓明)1; Hu M(胡明)1; Wang DS(王德生)1; Jiang D(姜栋)1; Sun JY(孙嘉奕)1; Zhou F(周峰)1; Weng LJ(翁立军)1; Liu WM(刘维民)1; Weng LJ(翁立军); Liu WM(刘维民) | |
The second department | 先进润滑与防护材料研究发展中心 |
2014 | |
Source Publication | Tribology Letters |
ISSN | 1023-8883 |
Volume | 55Issue:1Pages:1-13 |
Abstract | To improve the tribological properties of WS2 film both in vacuum and in humid air conditions, its microstructure was optimized by doping different concentrations of Cu via radio frequency co-sputtering method. The film microstructure and composition were investigated by field emission scanning electron microscopy, energy-dispersive X-ray spectroscopy, X-ray photoelectron spectroscopy, Raman spectroscopy, grazing incidence X-ray diffraction and high-resolution transmission electron microscopy. It was verified that Cu was presented in amorphous phase in the WS2 matrix and could also induce amorphization and densification of the composite films gradually. The film microstructure changed from coarse columnar platelet structure at low Cu content (0–5.8 at.%) to transition structure with two separate layers at increased Cu content (11.5–16.2 at.%) and to a featureless structure at high Cu content (above 24.4 at.%). The mechanical and tribological properties of films were evaluated using the scratch tester and ball-on-disk tribometer, respectively. It was found that the incorporation of a suitable content of Cu dopant could significantly improve the film toughness, but excess amount of Cu dopant lead to high brittleness. All the composite films exhibited much lower wear rate and longer wear life than those of pure WS2 film both in vacuum and in humid air conditions. The wear mechanisms were proposed after correlating the mechanical performance with film microstructure. |
Keyword | Ws2 Film Cu Dopant Microstructure Mechanical/tribological Properties |
Subject Area | 材料科学与物理化学 |
DOI | 10.1007/s11249-014-0322-3 |
Funding Organization | the National Key Basic Research Program of China (973) (Grant No. 2013CB632300);National Natural Science Foundation of China (Grant No. 51305427) |
Indexed By | SCI |
If | 1.739 |
Language | 英语 |
Funding Project | 空间润滑材料组;PVD润滑薄膜组;材料表面与界面行为研究组 |
compositor | 第一作者单位 |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.licp.cn/handle/362003/6837 |
Collection | 固体润滑国家重点实验室(LSL) 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
Corresponding Author | Weng LJ(翁立军); Liu WM(刘维民) |
Affiliation | 1.Chinese Acad Sci, State Key Lab Solid Lubricat, Lanzhou Inst Chem Phys, Lanzhou 730000, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China |
Recommended Citation GB/T 7714 | Xu SS,Gao XM,Hu M,et al. Microstructure Evolution and Enhanced Tribological Properties of Cu-Doped WS2 Films[J]. Tribology Letters,2014,55(1):1-13. |
APA | Xu SS.,Gao XM.,Hu M.,Wang DS.,Jiang D.,...&刘维民.(2014).Microstructure Evolution and Enhanced Tribological Properties of Cu-Doped WS2 Films.Tribology Letters,55(1),1-13. |
MLA | Xu SS,et al."Microstructure Evolution and Enhanced Tribological Properties of Cu-Doped WS2 Films".Tribology Letters 55.1(2014):1-13. |
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Microstructure Evolu(3290KB) | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text |
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