| Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea | |
| Department | 固体润滑国家重点实验室 |
Kang RX(康瑞雪)1,2; Liang J(梁军)1 ; Liu BX(刘百幸)1; Peng ZJ(彭振军)1; Liang J(梁军)
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| 2014 | |
| Source Publication | Journal of The Electrochemical Society
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| ISSN | 0013-4651 |
| Volume | 161Issue:10Pages:D534-D539 |
| Abstract | The deposition of copper (Cu) on aluminum (Al) is important for submicron interconnects and plating treatments of Al-based substrate. While aqueous deposition of Cu on Al is challenging on several technological and environmental problems. In this paper, we described electroless deposition of Cu onto Al surface through galvanic replacement from a simple and stable choline chloride (ChCl) based ionic liquid comprising a 1:2 stoichiometric mixture of ChCl and ethylene glycol (EG). Thermodynamic feasibility of Cu deposition by galvanic replacement on Al in ChCl-EG ionic liquid was studied by cyclic voltammetry. The effect of thiourea (TU) on the kinetics of galvanic replacement and the characterization of Cu layers were investigated by open circuit potential (OCP), electrochemical noise (ECN), scanning electron microscopy (SEM) and X-ray diffraction (XRD). Results showed that sustained deposition of Cu on Al surface was achieved in both the ChCl-EG ionic liquid solutions without and with addition of TU. The presence of TU in the ionic liquid restrained the galvanic replacement process, resulting in obtaining a compact and uniform Cu layer on Al surface. |
| Subject Area | 材料科学与物理化学 |
| DOI | 10.1149/2.0811410jes |
| Funding Organization | the “Hundred Talents Program” of Chinese Academy of Sciences (J. Liang) |
| Indexed By | SCI |
| If | 3.266 |
| Language | 英语 |
| Funding Project | 空间润滑材料组 |
| compositor | 第一作者单位 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/6812 |
| Collection | 固体润滑国家重点实验室（LSL） |
| Corresponding Author | Liang J(梁军) |
| Affiliation | 1.Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100080, Peoples R China |
| Recommended Citation GB/T 7714 | Kang RX,Liang J,Liu BX,et al. Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea[J]. Journal of The Electrochemical Society,2014,161(10):D534-D539. |
| APA | Kang RX,Liang J,Liu BX,Peng ZJ,&梁军.(2014).Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea.Journal of The Electrochemical Society,161(10),D534-D539. |
| MLA | Kang RX,et al."Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea".Journal of The Electrochemical Society 161.10(2014):D534-D539. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 5.pdf（646KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text | |
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