Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties
Department先进润滑与防护材料研究发展中心
Wang QH(王齐华); Wang C(王超); Wang TM(王廷梅); Wang C(王超); Wang TM(王廷梅)
The second department固体润滑国家重点实验室
2013
Source PublicationJournal of Colloid and Interface Science
ISSN0021-9797
Volume389Pages:99-105
AbstractIn the paper, controllable low dielectric macroporous polyimide (PI) films were prepared using silica microspheres as template, based on the solvent-evaporation-assisted in situ self-assembly of polyamic acid (PAA, precursor of PI) and silica microspheres in N,N-Dimethylformamide (DMF) solution. The interior microstructure of the macroporous PI films and its relationship with mechanical and dielectric properties were investigated. It was found that the macroporous PI films had triple-layer porous structures: ordered porous surface, dense layer in the middle, and interconnected porous structure at the bottom. The thickness of the dense layer in the middle changed with increasing weight content of silica. When SiO2 wt% was above 40%, the dense layer nearly disappeared. The interconnected porous structure at the bottom was quite homogenous, and the pore size could be controlled by the diameter of silica microspheres. Based on the experimental results, possible formation mechanism of the macroporous PI films was addressed. The mechanical properties of the macroporous PI films were degraded due to the introduction of air void. It was found that the degradation of mechanical properties of macroporous PI films with porosity of 37% is more obvious than that of PI films with porosity below 31%, which could be attributed to the triple-layer microstructure of the films. The air void introduction could effectively reduce the dielectric constant from 4.11 of PI dense films to 2.57 of porous PI films with porosity of 37%. The dielectric constant was only closely related to porosity and had no obvious connection with pore size.
KeywordDielectric Constant Macroporous Polyimide Films Template Triple-layer Structure
Subject Area材料科学与物理化学
DOI10.1016/j.jcis.2012.08.036
Funding Organizationthe National Science Foundation for Distinguished Young Scholars of China (Grant No. 51025517);the National Defense Basic Scientific Research Project (A1320110011)
Indexed BySCI
If3.552
Language英语
Funding Project聚合物自润滑复合材料组
compositor第一作者单位
Citation statistics
Cited Times:36[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.licp.cn/handle/362003/4374
Collection中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心
固体润滑国家重点实验室(LSL)
Corresponding AuthorWang C(王超); Wang TM(王廷梅)
AffiliationChinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China
Recommended Citation
GB/T 7714
Wang QH,Wang C,Wang TM,et al. Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties[J]. Journal of Colloid and Interface Science,2013,389:99-105.
APA Wang QH,Wang C,Wang TM,王超,&王廷梅.(2013).Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties.Journal of Colloid and Interface Science,389,99-105.
MLA Wang QH,et al."Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties".Journal of Colloid and Interface Science 389(2013):99-105.
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