| Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates | |
| Department | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
Qian Jia1 ; Zhixing Mu2; Xingkai Zhang1; Bin Zhang1; Ruixuan Liu2; Kaixiong Gao1; Yuanlie Yu1; Zhenguo Lai1; Junyan Zhang1
| |
| The second department | 607组 |
| 2021 | |
| Source Publication | Materials Today Chemistry
 |
| Issue | 21Pages:100521-100532 |
| If | 7.6128 |
| compositor | 第一作者单位 |
| Document Type | 期刊论文 |
| Identifier | http://ir.licp.cn/handle/362003/29979 |
| Collection | 中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心 |
| Corresponding Author | Bin Zhang |
| Affiliation | 1.中国科学院兰州化学物理研究所， 材料磨损与防护科技重点实验室 2.山西大学分子科学研究所晶体材料研究所 3.兰州理工大学石油化工学院 |
| Corresponding Author Affilication | Lanzhou Institute of Chemical Physics，Chinese Academy of Sciences |
| Recommended Citation GB/T 7714 | Qian Jia,Zhixing Mu,Xingkai Zhang,et al. Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates[J]. Materials Today Chemistry,2021(21):100521-100532. |
| APA | Qian Jia.,Zhixing Mu.,Xingkai Zhang.,Bin Zhang.,Ruixuan Liu.,...&Junyan Zhang.(2021).Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates.Materials Today Chemistry(21),100521-100532. |
| MLA | Qian Jia,et al."Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates".Materials Today Chemistry .21(2021):100521-100532. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Electronic conductiv（5193KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Application Full Text | |
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