LICP OpenIR  > 固体润滑国家重点实验室(LSL)
Adhesion studies of diamond-like carbon films on 202 stainless steel substrate with a silicon interlayer
Department固体润滑国家重点实验室 ; 先进润滑与防护材料研究发展中心
Ji L(吉利); Li HX(李红轩); Zhao F(赵飞); Chen JM(陈建敏); Zhou HD(周惠娣)
2008
Source PublicationKey Engineering Materials
ISSN1662-9795
Volume373-374Pages:151-154
AbstractA silicon interlayer was introduced between the DLC films and 202 stainless steel substrate using a medium frequency magnetron sputtering. The adhesion was evaluated by the scratch tests and wear tests together. Two main parameters in the deposition process of Si interlayers, i.e. the sputtering current and pulse bias voltage, were optimized respectively, and the action mechanisms were discussed as well. Moreover, a special treatment with the purpose of forming a complete graded intermixed Si-Fe interface was designed to improve the adhesion strength further. DLC films with good adhesion strength were deposited on 202 stainless steel substrates using a silicon interlayer.
KeywordDlc Films Silicon Interlayer Adhesion Stainless Steel Substrate
Subject Area材料科学与物理化学
Funding Organizationthe National Natural Science Foundation of China (Granted No: 50705093;50575217);Innovative Group Foundation from NSFC (Grant No. 50421502);"973" Project (Grant No. 2007CB607601);the foundational scientific research of China (Grant Nos. A1320060604)
Indexed ByEI
Language英语
Funding Project磨损和表面工程组
Document Type期刊论文
Identifierhttp://ir.licp.cn/handle/362003/2658
Collection固体润滑国家重点实验室(LSL)
中国科学院材料磨损与防护重点实验室/先进润滑与防护材料研究发展中心
Corresponding AuthorChen JM(陈建敏)
Recommended Citation
GB/T 7714
Ji L,Li HX,Zhao F,et al. Adhesion studies of diamond-like carbon films on 202 stainless steel substrate with a silicon interlayer[J]. Key Engineering Materials,2008,373-374:151-154.
APA 吉利,李红轩,赵飞,陈建敏,&周惠娣.(2008).Adhesion studies of diamond-like carbon films on 202 stainless steel substrate with a silicon interlayer.Key Engineering Materials,373-374,151-154.
MLA 吉利,et al."Adhesion studies of diamond-like carbon films on 202 stainless steel substrate with a silicon interlayer".Key Engineering Materials 373-374(2008):151-154.
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